Optocap’s assembly and packaging know-how enables our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments.
Our expertise in packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture. This provides customers adopting an outsourced manufacturing model with a much simplified and efficient supply chain.
Optocap provides a range of assembly services/applications including:
- Wafer Saw
- Au Ball, Au/Al Wedge and Ribbon wire bonding
- Au stud bumping
- Pick and Place
- Die bonding (eutectic and epoxy attach)
- Wire pull/Die Shear
- Epoxy dispense and stamping
- Flip Chip Assembly
- Fiber alignment and attach
- Hermetic sealing
- Ceramic and Plastic packaging
- Chip on Board
- Optoelectronic Packaging
- System-in-Package assembly
- RF Module packaging
- MEMS packaging
- Hybrid/MCM assembly
- X-ray imaging
- Environmental testing