Optocap Ltd - A Member of Alter Technology TUV NORD

Optocap Ltd provides contract packaging and assembly services for microelectronic and optoelectronic devices.


Optocap’s assembly and packaging know-how enables our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments.

Our expertise in packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture. This provides customers adopting an outsourced manufacturing model with a much simplified and efficient supply chain.

Optocap provides a range of assembly services/applications including:

  • Wafer Saw
  • Au Ball, Au/Al Wedge and Ribbon wire bonding
  • Au stud bumping
  • Pick and Place
  • Die bonding (eutectic and epoxy attach)
  • Wire pull/Die Shear
  • Epoxy dispense and stamping
  • Flip Chip Assembly
  • Fiber alignment and attach
  • Hermetic sealing
  • Ceramic and Plastic packaging
  • Chip on Board
  • Optoelectronic Packaging
  • System-in-Package assembly
  • RF Module packaging
  • MEMS packaging
  • Hybrid/MCM assembly
  • X-ray imaging
  • Environmental testing


5 Bain Square
EH54 7DQ

01506 403550